On-Site Report | SENASIC Debits at electronica China, Reshaping Battery Management with Physical AI Wireless BMS Chip Solutions

July 1, 2026 marked the official opening of the three-day electronica China at Shanghai New International Expo Centre. As a benchmark exhibition for Asia’s electronics industrial chain, the event covered an exhibition area of 120,000 square meters and gathered over 2,000 leading enterprises across semiconductors, power devices, automotive electronics and energy storage worldwide. Artificial intelligence, new energy and wireless sensing stood out as core themes running through the show. SENASIC brought its full lineup of Physical AI edge-side wireless intelligent chips to Booth 761, Hall N4. Featuring self-developed wireless BMS ICs and multi-scenario intelligent sensing solutions, the company joined domestic innovators of automotive and energy storage chips to explore new pathways for intelligent batteries with industry peers from home and abroad.

Focusing on Physical AI to Build Core Competitiveness in Edge-Side Wireless Intelligent SoCs

As a globally leading brand of Physical AI edge-side wireless intelligent chips, SENASIC has long dedicated itself to the R&D of all-in-one SoCs integrating high-precision sensing, real-time local computing and low-power wireless communication. The company deeply integrates multi-dimensional physical signal acquisition, edge-side AI computing power and wireless transmission onto a single chip, empowering intelligent upgrading of energy storage, new energy vehicles, automotive and industrial terminals.

Distinct from traditional discrete chip solutions widely adopted in the industry, all SENASIC products are built around the core design philosophy of an integrated "Sensing + Computing + Wireless" framework. Custom ICs have been developed for power batteries, energy storage, automotive tire monitoring and industrial sensing scenarios, breaking bottlenecks of conventional wired acquisition architectures and driving the shift of battery management and vehicle sensing equipment from wired hardware layouts to wireless digital solutions. At this exhibition, SENASIC showcased its four full product lines: wireless BMS, intelligent cell monitoring, general-purpose sensing and smart tire chips, covering the full-chain sensing demands of the new energy sector.

Debut of Flagship Innovative Product: SNBMS6801 Wireless BMS Reinvents Battery Management Architecture

The highlight of SENASIC’s booth is its newly launched SNBMS6801 single-cell wireless BMS dedicated chip, demonstrated alongside physical battery packs and a visualized upper computer system, emerging as a standout attraction in the new energy zone.

Tailored for high-reliability battery applications including large-scale energy storage power stations and new energy vehicle traction batteries, the SNBMS6801 eliminates the complex wiring harnesses of conventional systems, packing a complete set of core functions into one monolithic chip:

Multi-dimensional High-Precision Integrated Sensing: Simultaneously measures cell voltage, temperature, electrochemical impedance spectroscopy (EIS) and other multi-physical parameters. Leveraging on-board Physical AI algorithms, it conducts real-time analysis of battery status to accurately capture abnormal cell signals and enable early thermal runaway warning, fundamentally raising the safety threshold of battery systems.Wireless Synchronized Balancing Control: Embedded low-power wireless communication links support wireless transmission of cell-level data alongside distributed balancing management. This drastically simplifies PACK wiring structures and cuts costs related to BMS materials, assembly and maintenance.Full-Lifecycle Digital Infrastructure: Supports remote over-the-air (OTA) firmware upgrades and complete recording of cell operating data throughout its service life. It provides hardware foundations for digital batteries, electronic battery passports and secondary utilization of retired batteries, aligning with the digital transformation trends of energy storage operators and automotive OEMs.

A dedicated demonstration station with physical battery packs and matching visualized upper computer systems was set up on site. Visitors could directly view real-time curves of voltage, internal resistance and temperature for each single cell, and experience the convenience and data accuracy of the wireless acquisition architecture first-hand. Numerous engineers from vehicle manufacturers and energy storage system integrators stopped by to discuss details of solution implementation.

On-site Demonstration of SNBMS6801 Wireless BMS Chip Equipped Battery Pack and Upper Computer System

Full Portfolio of Sensing Chips Showcased for Diverse Automotive & Energy Storage Applications

Beyond its flagship wireless BMS chip, SENASIC exhibited multiple mass-produced mature product lines to enrich its Physical AI sensing ecosystem:

Intelligent Cell Monitoring Chips: Designed for standardized power battery PACK development, compatible with prismatic and cylindrical cell modules, supporting both wired and wireless architectures for passenger vehicles, commercial vehicles and energy storage equipment.General-Purpose Intelligent Sensing Chips: Developed for industrial equipment, energy storage cabinets and low-speed vehicles, integrating multi-physical quantity acquisition and local computation for lightweight edge sensing terminals.Smart Tire Chips: Automotive-grade wireless TPMS sensing solutions delivering high-precision monitoring of tire pressure, temperature and deformation data, supplying underlying data for vehicle active safety and intelligent chassis control.

The complete product portfolio delivers end-to-end sensing solutions spanning "single cells – battery packs – complete vehicles – energy storage power stations", perfectly matching the two dominant industry trends of new energy and AI digitalization featured at the exhibition. It also reflects the industry-wide transformation of domestic sensing chips evolving from discrete components to system-level solutions.

On-Site Display of SENASIC’s Full Lineup of Sensing Chips at the Booth

In-Depth On-Site Interview Decodes New Opportunities for Domestic Wireless Sensing Chips

At the exhibition, Mr. Zhu Shouteng, President of SENASIC, accepted an exclusive interview with Elecfans, an authoritative industry media outlet. The in-depth conversation covered a wide range of topics including the company’s positioning as the world’s first listed firm focused on Physical AI edge-side sensing & computing chips following its Hong Kong IPO, core exhibition products, underlying technology platform, cross-scenario deployment logic and the development of a global supply chain system.

As a first-time exhibitor at electronica China, Mr. Zhu stated that the show brought substantial gains for SENASIC. The company fully demonstrated the technical strengths of its three core product lines – smart tire chips, intelligent cell chips and general-purpose sensing chips – and conducted thorough technical exchanges and demand alignment with upstream and downstream partners as well as industry peers. He also identified the core evolution trend of wireless sensing SoCs toward edge-side AI capability, wireless connectivity and high integration. SENASIC will continue to deepen its layout in Physical AI edge-side wireless intelligent chips, iterating products across four key sectors: smart energy, robotics, automotive electronics and high-end industrial equipment. The brand will maintain its participation in electronica China to jointly advance technological upgrading and large-scale commercialization of domestic wireless sensing chips alongside the industry.

Mr. Zhu Shouteng, President of SENASIC

Exclusive Interview Session: Mr. Zhu Shouteng (Left), President of SENASIC, with Elecfans Journalist

New Industrial Landscape: Edge-Side Wireless Sensing Ushers in a New Era of Energy Digitalization

AI and new energy emerged as two unmissable central themes at this year’s electronica China. As manufacturers across the board ramp up investment in edge intelligence and energy digitalization, wireless battery management technology has become a core innovation frontier for the next phase of the new energy industry.

Centered on Physical AI wireless intelligent chips, SENASIC leverages self-developed wireless BMS ICs to build the underlying digital infrastructure for batteries, with sustained focus on high-reliability sensing solutions for automotive and energy storage applications. Amid accelerated technological breakthroughs of domestic semiconductor enterprises, SENASIC will keep advancing integrated edge-sensing technologies. Its proprietary chips will fuel intelligent transformation across the new energy sector, collaborating with upstream and downstream partners to foster a brand-new industrial ecosystem for next-generation wireless battery management systems.