SENASIC x ST | Co-Charting a New Blueprint for Physical AI On-Device Intelligent Chips
- 2026-06-01
- Events
Recently, Dr. Mengxiong Li, Founder of SENASIC, and Henry Cao, Executive Vice President and President of China Region at STMicroelectronics (hereinafter referred to as "ST"), a global semiconductor leader, officially signed a non-binding Memorandum of Understanding (MoU) in Shanghai, China.
(Image: Dr. Mengxiong Li, Founder of SENASIC [Left], and Henry Cao, Executive Vice President and President of China Region at ST [Right])
Focusing on Edge AI Smart Sensing
Under the MoU, the two parties will synergize their respective strengths in MEMS, sensor technology, ASIC design, and the broader semiconductor sector. Centered on key metrics such as performance, power consumption, and reliability, they will identify collaborative opportunities and future innovation pathways across chip design, integration, packaging, and system optimization, jointly exploring edge AI smart sensing solutions.
Co-Defining the New Future of Smart AI Battery Chips
SENASIC has a long-standing commitment to the R&D of on-device wireless intelligent chips. The company is dedicated to deeply integrating wireless connectivity, low-power design, and edge AI to empower "every sensing node" and "every battery cell" with real-time perception, intelligent analysis, and collaborative control.
SENASIC and ST will jointly explore collaborative opportunities in advanced battery monitoring technologies and Battery Management Systems (BMS). These applications will span Energy Storage Systems (ESS) and Electric Vehicles (EV). By leveraging highly precise battery sensing, smarter edge computing, and system synergy, the collaboration aims to further enhance battery safety, intelligence levels, and overall system efficiency.
(Image: Group photo of both parties at the SENASIC x ST signing ceremony)
Looking Ahead
The signing of this MoU reflects SENASIC's continuous strategic expansion in the fields of edge AI smart sensing and battery intelligence. It also signifies that SENASIC and STMicroelectronics have established a closer foundation for collaboration in cutting-edge technological frontiers. Looking ahead, SENASIC will continue to join hands with leading global partners to collectively drive the intelligent development of on-device AI and the new energy industry.