SENASIC Unveils New Physical AI Edge Wireless Intelligent Bluetooth TPMS Chip at SENSORCHINA2026

On September 16, the new product launch event of SENSOR CHINA 2026 (China International Sensor Technology and Application Exhibition, Shanghai) was successfully held. Liang Bin, Product Line Manager of ITC Smart Tire Chips at SENASIC (06675.HK), officially launched the ultra-low-power Bluetooth TPMS chip SNP756 during the on-site new product launch conference, bringing a brand-new domestic chip solution for the smart vehicle tire sensing and computing track.

As a leading domestic enterprise in wireless automotive-grade sensing, SENASIC leveraged this sensor exhibition to showcase its new TPMS products designed for next-generation intelligent chassis. Developed to meet vehicle-level requirements for tire safety, low power consumption, compatibility and architecture upgrade, the new product further strengthens the application value of domestic Bluetooth TPMS chips in automotive intelligent scenarios.

Amid the wave of automotive electrification and intelligence, tires have evolved from conventional components into critical sensing terminals for the whole vehicle. The performance and reliability of TPMS chips constitute a vital part of the vehicle’s active safety system. With the launch of SNP756, SENASIC aims to address the upgrade demands of OEMs and Tier‑1 suppliers for smart tire sensing systems through a chip solution featuring higher integration, lower power consumption and enhanced safety response capability.

Drawing on years of experience in automotive-grade chip R&D, SENASIC continues to build product capabilities in the smart tire sensing and computing sector. The debut at SENSOR CHINA represents not only a concentrated showcase of the company's technical achievements, but also reinforces SENASIC's commitment to advancing automotive sensor upgrades with domestic automotive-grade chips.